UV LASER MARKING MACHINES SERIES
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Machine Applications
UV laser marking machine laser marking machine belongs to a series of products, but its use of 355nm UV laser research and development, the machine uses the third-order cavity frequency doubling technology compared with the infrared laser, UV 355 small focused spot, can greatly reduce the mechanical deformation of materials and processing small heat affected because mainly used for ultra-fine marking, engraving, particularly suitable for food, pharmaceutical packaging material marking, porous, high-speed divided silicon and glass materials wafer cutting and other complex graphics applications.
Machine Feature
- Good beam quality, small, focused spot, small heat-affected processing, to achieve ultra-fine markers.
- Can be ultra-fine processing and special material marking is the marking effect and have higher expectations of customers choice.
- In addition to copper UV laser material suitable for processing the material more widely.
- Are cold laser marking processing, thermal effects are relatively low, no material burning issue.
- Marking speed, high efficiency.
- Stable performance, small size and low power consumption.
- Small power UV laser-based, mainly based on the requirements of its power to customize the
- processing of materials, processing and power have a great effect association.
Technical-Parameters
Product model | FMUVSW / FMUV1OW |
Power | SW /10W |
Wave length of laser | 355nm |
Repeatability | 0.003mm |
Working area | 100x100mm |
Marking speed | <7000mm/s |
Switch frequency | 8KHz / 15KHz |
Voltage | AC/220/50Hz/ Customizable |
Total Consumption | Depending on the laser selection |
Cooling system | According optional laser powe |
Indicate light | Red (optional) |
Chiller | CWUL5200 |